Current Affairs · Science and Technology Infrastructure
Consider the following statements regarding India's first advanced 3D glass chip packaging unit: I. The facility is being set up by US-based 3D Glass Solutions Inc. (3DGS) at Info Valley in Bhubaneswar. II. It will utilize conventional silicone substrates for its advanced 3D heterogeneous integration (3DHI) packaging. III. The project was approved in 2025 as part of a broader push that greenlit semiconductor projects nationwide. Which of the statements given above is/are correct?
Verified Solution4 OptionsUpdated: October 2026👁️1 View
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- 1All I, II, and III
- 2Only II and III
- 3Only I and III✓
- 4Only I and II
Correct answer
Only I and III
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